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Cooler Master’s new Thermal Pad is an innovative solution to device cooling for a vast range of your electronic devices and components. 13.3w/mK thermal conductivity for rapid cooling, capable of drawing high levels of heat. Safe and simple formula with electrically insulated and heat resistant properties to prevent hardening. Provides seamless and secure contact between surfaces. Electronic devices, motherboards, components (CPU, GPU, USICS, Hard Drives, Disk Drives, IGBT module), laptops and various products requiring cooling. Easily cut to the perfect size for your application. Multiple choices of thickness are available.
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