
Hp Omen Max 16 Ultra 9 275HX 1.5GB SSD 64GB 16.0 Inch OLed 2.5K 2560×1600 Inch RTX 5090 Processor (CPU): Intel® Core™ Ultra 9 275HX (24 Cores / 24 Threads, 36MB L3 Cache, up to 5.4 GHz Max Turbo Frequency) with integrated Intel® AI Boost NPU. Graphics (GPU): NVIDIA® GeForce RTX™ 5090 Laptop GPU (24GB GDDR7 dedicated VRAM, running at up to 175W TGP via Omen Dynamic Boost). System Memory (RAM): 64GB DDR5-5600 MHz Dual-Channel (2 x 32GB SODIMM modules, user-upgradeable). Storage: 2TB PCIe® Gen4 NVMe™ M.2 Performance SSD (Dual M.2 slots available for further expansion). [ 1 , 2 , 3 , 4 ] 🖥️ Display & Visuals Screen Size: 16.0-inch diagonal. Panel Type: BrightView OLED Display with edge-to-edge glass and micro-edge bezels. Resolution: 2.5K WQXGA (2560 x 1600 pixels) in a 16:10 productivity aspect ratio. Refresh Rate: 240 Hz with Variable Refresh Rate (VRR) support and a ultra-low 0.2 ms response time. Color Profile: 100% DCI-P3 wide color gamut coverage. Brightness: 400 nits SDR / 500 nits HDR peak brightness. 🔌 Connectivity & I/O Ports Thunderbolt Ports: 2 x Thunderbolt™ 4 / USB Type-C® 40Gbps signaling rate (supports USB Power Delivery, DisplayPort™ 1.4, and HP Sleep and Charge). USB-A Ports: 2 x USB Type-A 10Gbps signaling rate. Video Out: 1 x HDMI 2.1. Networking: 1 x RJ-45 Gigabit Ethernet port. Audio: 1 x 3.5mm Headphone/Microphone combo jack. Wireless: Intel® Wi-Fi 7 BE200 (2×2) paired with Bluetooth® 5.4. 🔋 Design, Power, & Cooling Cooling System: OMEN Tempest Cooling PRO (dual self-cleaning fans, OMEN Cryo Compound thermal paste, and IR sensor optimization). Audio System: Dual stereo speakers custom-tuned by HyperX with DTS:X® Ultra and HP Audio Boost. Keyboard: Full-size lattice-less keyboard featuring per-key RGB backlighting and an integrated numeric keypad. Webcam: HP True Vision 1080p FHD IR camera equipped with a physical privacy shutter and integrated dual-array digital microphones. Battery: 6-cell, 83 Wh Lithium-ion polymer battery. Chassis Weight: Approximately 5.92 lbs / 2.68 kg. Operating System: Windows 11 1 YEAR WARRANTY The HP OMEN MAX 16T-AH000 utilizes the custom-engineered OMEN Tempest Cooling PRO thermal architecture. Designed specifically to handle up to a 300W total platform power limit without needing an external liquid cooling dock, it combines advanced thermal materials and mechanical airflow re-engineering. [ 1 , 2 , 3 ] The full breakdown of its cooling system includes: Thermal Dissipation & Materials Hybrid Vapor Chamber & Heat Pipes : Features an expanded, vacuum-sealed copper Vapor Chamber (VC) covering approximately 60% of the motherboard. It pairs with high-capacity heat pipes to distribute thermal energy away from the dense CPU and GPU cores quickly. [ 1 ] OMEN Cryo Compound : Uses a hybrid, high-viscosity thermal compound made of silicone-coated liquid metal (gallium) applied to both the Intel Ultra 9 CPU and RTX 5090 GPU. The silicone coating prevents traditional liquid metal leakage while retaining elite thermal conductivity. [ 1 , 2 ] Airflow & Mechanical Design Tri-Fan Setup : Upgraded to a 3-fan system (two main exhaust fans and a third dedicated air intake fan) to maximize static pressure. [ 1 ] Self-Cleaning Fan Technology : Jointly developed with Intel, these fans automatically reverse direction at the end of computing sessions to actively blow out dust and prevent buildup over time. [ 1 , 2 ] Expanded Ventilation Space : Internal clearance is increased with a 1.6mm larger fan-to-chassis gap and 1.5mm more clearance between the motherboard and keyboard, producing 1.5x more total airflow than previous OMEN generations. Smart Monitoring Infrared Thermopile Sensor : Continually reads internal chassis temperatures in real-time, feeding data directly to the OMEN Gaming Hub to dynamically adjust fan curves and balance acoustic noise against maximum clock speeds. [ 1 ] Watch these hardware overviews to see how the OMEN Tempest Cooling PRO handles the heat during heavy workloads:
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